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protocol.\nAddress of I2C component is set to 000\n\nThe data sheet can be found here:\nhttps://www.ti.com/lit/ds/symlink/lm75b.pdf?ts=1713925293992" (exclude_from_sim no) (at 80.01 82.296 0) (effects (font (size 1.27 1.27) ) ) (uuid "e4c16bd3-7e08-40d4-9642-f11e455ddc52") ) (text "R1, R2, R3 are\npull-up resistors\n\nC1 is a bypass\ncapacitor to clean\nthe input voltage" (exclude_from_sim no) (at 18.542 67.31 0) (effects (font (size 1.27 1.27) ) (justify left) ) (uuid "e6e7de94-00f2-4926-8df9-f24ff5486283") ) (text "1. Are the pullup resistors\nnecessary,or will the\nmicrocontroller handle this?\n\n2. The datasheet says to have a\n100nF bypass capacitor, but it\nalso mentions having 10uF\nbulk capacitor in the vicinity.\nDoes this matter?\n\n3. Are the mounting holes the\ncorrect size (M2)?\n\n4. Footprint for LM75B is\ncurrently set to VSSOP\npackage. Is this a problem?\n\n5. TekBots offers what seems\nto be an LM75A module that\nintegrates all of this design\nin a single package without\nthe need for individual soldering\nof componenets. Can I just use\nthat as my block, or do I need\nto design it myself?" 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