This project focuses on developing a multi-zone thermal control system for semiconductor manufacturing testing. Temperature regulation during semiconductor testing is critical for ensuring device reliability and performance. Traditional thermal control systems typically use a single-zone approach that regulates heating and cooling based only on the hottest region, or hotspot, of the chip. As a result, cooler regions can remain below the desired setpoint temperature and become under-tested. The purpose of our system is to improve chip temperature uniformity during testing by independently controlling different regions of the device rather than relying on a single hotspot-based thermal control method. The system uses multiple independently controlled heating zones integrated into a thermal head to reduce temperature gradients across the chip. A resistive test vehicle was used to simulate non-uniform chip power distributions by selectively powering different regions of the die. Temperature measurements were collected using 4-wire RTD sensors placed throughout the test vehicle, and the sensor signals were converted into digital data using the AD7124-8 ADC. An ESP32 microcontroller processes the temperature data and performs the control actions for each thermal zone. One of the main accomplishments of the project was successfully demonstrating independent thermal zone monitoring and control using multiple sensors and heaters. A major challenge was managing temperature gradients caused by uneven heating across the die while maintaining stable control behavior. Future improvements include implementing liquid cooling, increasing the number of heating zones and sensors, replacing relay-based control with PWM heater control, and integrating the system electronics onto a single PCB.